| Dihe Electronics Production Capacity | ||
| Item | Standard | Limitation |
| Layer count | 1~30L | 30L |
| Board thickness | 0.2~10.0 mm | 0.2~10.0 mm |
| Base Material | CEM1,CEM-3, FR-4(Normal to High Tg),Halogen-free, High CTI,ISOLA, Rogers, Teflon,Taconic,Metal Base(Copper/Aluminum/Stainless Steel/Iron) | High frequency series |
| Copper thickness | 0.5~12 OZ | Min. base copper 1/4 OZ Max. base copper 20 OZ |
| Surface finish | HAL Leaded, HAL Leadfree, ENIG(Immersion Gold),Immersion Tin(Chem. Tin), OSP,Gold Finger, Immersion Silver(Ag), Hard gold plating,ENIG+OSP,HAL+Hard gold fingers,Immersion Ni/Pa/Au(ENEPIG) | Hybrid Surface treatment |
| Max. aspect ratio | 12:01 | 15:01 |
| Max Board size | 580X620(mm) | 580X1180(mm) |
| Min. Copper tracks Width/Space | 3/3 mil | 2.5/2.5 mil |
| Color of Soldermask | Black,White,Blue,Green; Red,Matte Green, Matte Black,Matte Blue, Matte Red,Purple,Gray | Yellow,Coffee,Gray,Orange |
| Copper thickness on PTH’s wall | 12um~25um normal; | Max. 50um |
| Impedance control Tolerance | +/-10% | +/-8%(>=100 Ohm) |
| Slot size tolerance | ±0.075mm(board thickness≤1.0mm) ±0.10mm (board thickness>1.00mm) | |
| Min. CNC Drilling bit | 8mil/0.2mm | 6mil/0.15mm |
| Min. Laser Drilling bit | 4mil/0.1mm | 4mil/0.1mm |
| Min. W/D of Coil | 4mil/0.1mm | 4mil/0.1mm |
| Tolerance of PTH | ±0.075mm/3mil | ±0.05mm/2mil |
| Warpage | 0.75% Max. | 0.5%(Max.) |
| Hole size by drilling | 0.2mm~6.5mm | 0.15mm~6.5mm |
| Carbon min. Width | 14mil | 12mil |
| Leadfree HAL Thickness | 0.8um~40um | 2.5um~40um |
| Package | EPE Foam & Vacuum Packing | Vacuum Package Bags |
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