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Layer: 2 Layer
Base:Material: Standard FR4 Tg130
Copper thickness:1oz finish
Thickness:10.0 mm+/-10%
Surface finish: ENIG(Immersion Gold)
Au thickness:MIN.2U”
| Dihe Electronics Production Capacity | |
| Item | Standard |
| Layer count | 1~30L |
| Board thickness | 0.2~10.0 mm |
| Base Material | CEM1,CEM-3, FR-4(Normal to High Tg),Halogen-free, High CTI,ISOLA, Rogers, Teflon,Taconic,Metal Base(Copper/Aluminum/Stainless Steel/Iron) |
| Copper thickness | 0.5~12 OZ |
| Surface finish | HAL Leaded, HAL Leadfree, ENIG(Immersion Gold),Immersion Tin(Chem. Tin), OSP,Gold Finger, Immersion Silver(Ag), Hard gold plating,ENIG+OSP,HAL+Hard gold fingers,Immersion Ni/Pa/Au(ENEPIG) |
| Max. aspect ratio | 12:01 |
| Max Board size | 580X620(mm) |
| Min. Copper tracks Width/Space |
3/3 mil |
| Color of Soldermask | Black,White,Blue,Green; Red,Matte Green, Matte Black,Matte Blue, Matte Red,Purple,Gray |
| Copper thickness on PTH’s wall | 12um~25um normal; |
| Impedance control Tolerance | +/-10% |
| Slot size tolerance | ±0.075mm(board thickness≤1.0mm) ±0.10mm (board thickness>1.00mm) |
| Min. CNC Drilling bit | 8mil/0.2mm |
| Min. Laser Drilling bit | 4mil/0.1mm |
| Min. W/D of Coil | 4mil/0.1mm |
| Tolerance of PTH | ±0.075mm/3mil |
| Warpage | 0.75% Max. |
| Hole size by drilling | 0.2mm~6.5mm |
| Carbon min. Width | 14mil |
| Leadfree HAL Thickness | 0.8um~40um |
| Package | EPE Foam & Vacuum Packing |
